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Ceramic Bond Descriptions

Ceramic Bond Descriptions

KP - POLISH (WHITE)

A ceramic media without any abrasives. For burnishing, polishing and driving loose abrasive.

KLC - LIGHT CUT (TAN)

For general finishing, light cut and low to medium wear. Leaves a bright finish when used with proper compounds.

KM - GENERAL PURPOSE (GRAY)

For general finishing, good metal removal and exceptional wear. Performs in a wide variety of deburring, deflashing and radiusing applications. Our most popular formulation.

KSF - FAST CUTTING (GRAY)

Fast cutting media that provides a good finish with a tough longwearing bond.

KXF - EXTRA FAST CUTTING (TAN)

A media designed for fast metal removal, surface improvements and a low rms finish. Matte finish and moderate wear rate, but very efficient due to reduced cycle times.

KUFX - ULTRA AGGRESSIVE (BLUE-GRAY)

Our most aggressive media formulation where metal removal, radiusing and cycle times are primary concerns.

KDF - DENSE SUPER FAST CUTTING (BROWN)

Extremely resistant to fracturing. Ideal for high-energy applications. A very fast cut facilitated by heavier weight per cubic foot.

KSC - SILICON CARBIDE (GRAY)

A media used where aluminum oxide impregnation cannot be tolerated, such as braising, welding or soldering.

Has good cutting characteristics and good wear.